Ulayini wokupakisha we-wafer ozenzakalelayoimboni ibilokhu ihlangabezana nentuthuko enkulu, okumaka isigaba soshintsho endleleni imikhiqizo yama-wafer epakishwa ngayo futhi ilungiselelwa ukusatshalaliswa ezinhlobonhlobo zokukhiqiza nokucutshungulwa kokudla. Lo mkhuba wokuqanjwa uzuza ukudonseka nokwamukelwa ngenxa yekhono lawo lokuthuthukisa ukusebenza kahle kokupakisha, ubuqotho bomkhiqizo kanye nezishintshayo, okuwenza ube yinketho ephezulu kubakhiqizi bama-wafer, izinkampani zamaconfectionery kanye nezindawo zokupakisha ukudla.
Enye yentuthuko ebalulekile embonini yomugqa wokupakisha we-wafer ozenzakalelayo ukuhlanganiswa kobuchwepheshe bokupakisha obusezingeni eliphezulu kanye ne-robotic automation ukuze kukhuliswe isivinini nokunemba. Imigqa yokupakisha ezenzakalelayo yesimanje isebenzisa izinto zekhwalithi ephezulu kanye nomklamo wemishini wesimanje ukuze kuqinisekiswe ukupakishwa okungenamthungo kwemikhiqizo yama-wafer. Ukwengeza, le migqa yokupakisha ifakwe izingalo zerobhothi, amaconveyor anesivinini esikhulu kanye nezinhlelo zokulawula ezithuthukisiwe ukuze zipakishe kahle futhi ngokunembile imikhiqizo yama-wafer ngenkathi kuncishiswa isikhathi sokuphumula kanye nokumoshakala komkhiqizo.
Ngaphezu kwalokho, ukukhathazeka mayelana nokusimama kanye nokunciphisa imfucuza kuye kwaqhuba ukuthuthukiswa kwemigqa yokupakisha ye-wafer ezenzakalelayo, okusiza ukuthuthukisa ukusetshenziswa kwezinsiza kanye nomthelela wemvelo. Abakhiqizi baya ngokuya beqinisekisa ukuthi imigqa yokupakisha ezenzakalelayo iklanyelwe ukuthuthukisa izinto zokupakisha, ukunciphisa ukusetshenziswa kwamandla kanye nokunciphisa umonakalo womkhiqizo ngesikhathi sokupakisha. Ukugcizelelwa kokusimama kwenza imigqa yokupakisha ye-wafer ezenzakalelayo ibe okufanele ube nayo ukuze kube nomsebenzi wokupakisha ovumelana nemvelo nokusebenza okuphezulu embonini yokukhiqiza ukudla.
Ukwengeza, ukwenziwa ngendlela oyifisayo nokuvumelana nezimo kwemigqa yokupakisha ye-wafer ezenzakalelayo iyenza ibe ukukhetha okudumile kwezinhlelo zokusebenza ezihlukene zokupakisha kanye nezidingo zokukhiqiza. Le migqa yokupakisha itholakala ekucushweni okuhlukahlukene, okuhlanganisa nezinhlelo zokupakisha ezimise okuka-L, ukuze kuhlangatshezwane nezidingo ezithile zokupakishwa kwe-wafer, noma ngabe ukupakishwa kwe-wafer okuyingxenye eyodwa, ukucushwa kwamaphakethe amaningi noma imiklamo yokupakisha yangokwezifiso. Lokhu kuvumelana nezimo kuvumela abakhiqizi bama-wafer kanye nezindawo zokupakisha ukudla ukuthi bathuthukise ukusebenza kahle kanye nekhwalithi yezinqubo zabo zokupakisha futhi baxazulule izinselele ezihlukahlukene zokupakisha.
Njengoba imboni iqhubeka nokubona intuthuko kubuchwepheshe bokupakisha, ukusimama kanye nokwenza ngokwezifiso, ikusasa lemigqa yokupakisha ye-wafer ezenzakalelayo ibonakala ithembisa, namandla okuqhubeka nokwenza ngcono ukusebenza kahle kanye nekhwalithi yemisebenzi yokupakishwa kwe-wafer emikhakheni ehlukene yokukhiqiza ukudla.
Isikhathi sokuthumela: Jun-12-2024